Multilayer
Standard
External layersInternal layers
Basic copperFinal copper (1)Min. ring (2)Basic copperFinal copper (3)Min. ring (4)
18µm43µm200µm/8mil35µm35µm250µm/10mil
35µm60µm200µm/8mil70µm70µm275µm/11mil
With overhead expenses
External layerInternal layer
Basic copperFinal copperMin. ring (1)Basic copperFinal copperMin. ring (2)
70µm95µm300µm/12mil105µm105µm325µm/13mil
105µm130µm325µm/13mil   

 The min. thickness of the final copper is given in the above table.

 

 

 

1. Final copperexternal layer

2. Min. ringexternal layer

3. Final copperinternal layer

4. Min. ringinternal layer

5. Final hole diameter after copper-plating and soldering

6. Drill diameter

7. Pad size external layer

8. Pad size – internal layer 

 

 

When the internal layer is a shield (for example ground) the hole, which is not connected to internal layer’s shield should be without pad in the same layer. Min. 0.4mm ring around the hole is recommended to have no copper plating.